Assembly - Products - CCI Eurolam

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PCB Gedruckte Elektronik Assembly Mikroelektronik Leistungselektronik Oberflächenbehandlung Chemisches Formätzen Photovoltaik

Lötpaste

Als führendes Unternehmen in der Löttechnologie bietet Indium Corporation eine Reihe von Lötpasten für die Montage mit vielen verschiedenen Legierungen und Flussmitteltechnologien an, um viele Ihrer Prozessherausforderungen zu lösen, wie z.B. miniaturisierte Komponenten, Fine-Pitch, Voiding, Drucken und Reflow-Leistung.

Lötvorformlinge

Die Indium Corporation ist weltweit führend in der Entwicklung und Herstellung von hochwertigen Lotvorformen, die in einer Vielzahl von Anwendungen eingesetzt werden, die präzise Lot- oder Flussmittelmengen erfordern, wie z.B. Pin-in-Paste, Void-Reduzierung oder gleichmäßige Bondline. Sie sind in verschiedenen Formen, Größen und Legierungen erhältlich und können mit einer Flussmittelbeschichtung oder Verstärkung versehen werden.

ELPEGUARD® Conformal Coating

ELPEGUARD® conformal coatings are used to protect and insulate assembled pcbs so that they can fulfil higher requirements regarding reliability and service life.

ELPECAST® Casting Compounds

ELPECAST® casting compounds protect and insulate electronics, sensor technology and lighting electronics against extreme weather conditions and aggressive media. A large variety of transparent and opaque products fulfills numerous individual requirements and customer requests.

Solder Wires & Fluxes

Indium Corporation manufactures a broad range of solid and flux-cored solder wire. Available in several diameters, several alloys and high to very low flux %. It manufactures as well a broad range of TacFlux™ and flux pens.

Thermabond® Adhesives Film

Thermabond® Silicone Electronic Adhesive products by Rogers Corporation are thermally conductive silicone rubber-based adhesives for decoupling CTE and heat induced stress in electronic assemblies

Metal TIMs

The dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. Indium Corporation is a leader in the development of both solder and metal-based thermal interface materials (TIM) for a wide variety of applications.

Semiconductor Assembly

Indium Corporation’s semiconductor packaging and assembly materials address todays challenges and help power the future with solders and flux for System-in-Package (SiP), Heterogeneous Integration Assembly (HIA), MEMs assembly, flip chip bonding and BGA ball attach.

Adhesives

Epoxy and UV adhesives from structural bonding, to thermally conductive adhesives, bonding, chip assembly, bonding plastic, glass, metal...

Electrically conductive adhesives

Electrically conductive adhesives are employed in integrated circuit packaging in order to provide a permanent mechanical connection for joining components and at the same time enabling electrical contact of the components.